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首頁晶振行業(yè)動(dòng)態(tài) Ecliptek用于節(jié)能MCU的音叉晶體EB13K2C2H-32.768K

Ecliptek用于節(jié)能MCU的音叉晶體EB13K2C2H-32.768K

來源：http://www.lbfp.com.cn 作者：億金電子 2022年05月05
       在過去的兩年中，供應(yīng)鏈的挑戰(zhàn)使得具有較低電鍍負(fù)載的行業(yè)標(biāo)準(zhǔn)3.2x1.5mm和2.0x1.2mm音叉石英晶體的大批量供應(yīng)變得非常復(fù)雜。但是，Abracon的1.6x1.0x0.5mmABS05鍍4.0pF可以輕松替代當(dāng)前節(jié)能MCU和其他大猩猩芯片組設(shè)計(jì)中的更大尺寸替代品，而不會(huì)犧牲性能要求或增加額外的設(shè)計(jì)壓力。它還可以在較新的設(shè)計(jì)中進(jìn)一步減少消耗的表面積。此外，設(shè)計(jì)人員可能希望在他們的設(shè)計(jì)中考慮全面、包羅萬象的焊盤圖案。
EB13K2C2H-32.768K CMOS 3.3Vdc SMD2.0mmx2.5mm ±100ppm 0°Cto+70°C
EB13K2D2H-32.768K CMOS 3.3Vdc SMD2.0mmx2.5mm ±50ppm 0°Cto+70°C
EB13K2E2H-32.768K CMOS 3.3Vdc SMD2.0mmx2.5mm ±25ppm 0°Cto+70°C
EB13K2F2H-32.768K CMOS 3.3Vdc SMD2.0mmx2.5mm ±20ppm 0°Cto+70°C
EB13K2G2H-32.768K CMOS 3.3Vdc SMD2.0mmx2.5mm ±100ppm -40°Cto+85°C
EB13K2H2H-32.768K CMOS 3.3Vdc SMD2.0mmx2.5mm ±50ppm -40°Cto+85°C
EB13K2J2H-32.768K CMOS 3.3Vdc SMD2.0mmx2.5mm ±25ppm -40°Cto+85°C
EB13K4C2H-32.768K CMOS 3.3Vdc SMD2.5mmx3.2mm ±100ppm 0°Cto+70°C
EB13K4D2H-32.768K CMOS 3.3Vdc SMD2.5mmx3.2mm ±50ppm 0°Cto+70°C
EB13K4E2H-32.768K CMOS 3.3Vdc SMD2.5mmx3.2mm ±25ppm 0°Cto+70°C
EB13K4G2H-32.768K CMOS 3.3Vdc SMD2.5mmx3.2mm ±100ppm -40°Cto+85°C
EB13K4H2H-32.768K CMOS 3.3Vdc SMD2.5mmx3.2mm ±50ppm -40°Cto+85°C
EB13K4J2H-32.768K CMOS 3.3Vdc SMD2.5mmx3.2mm ±25ppm -40°Cto+85°C
EB13K5C2H-32.768K CMOS 3.3Vdc SMD3.2mmx5.0mm ±100ppm 0°Cto+70°C
EB13K5D2H-32.768K CMOS 3.3Vdc SMD3.2mmx5.0mm ±50ppm 0°Cto+70°C
EB13K5E2H-32.768K CMOS 3.3Vdc SMD3.2mmx5.0mm ±25ppm 0°Cto+70°C
EB13K5F2H-32.768K CMOS 3.3Vdc SMD3.2mmx5.0mm ±20ppm 0°Cto+70°C
EB13K5G2H-32.768K CMOS 3.3Vdc SMD3.2mmx5.0mm ±100ppm -40°Cto+85°C
EB13K5H2H-32.768K CMOS 3.3Vdc SMD3.2mmx5.0mm ±50ppm -40°Cto+85°C
EB13K5J2H-32.768K CMOS 3.3Vdc SMD3.2mmx5.0mm ±25ppm -40°Cto+85°C
EB13K7C2H-32.768K CMOS 3.3Vdc SMD5.0mmx7.0mm ±100ppm 0°Cto+70°C
EB13K7D2H-32.768K CMOS 3.3Vdc SMD5.0mmx7.0mm ±50ppm 0°Cto+70°C
EB13K7E2H-32.768K CMOS 3.3Vdc SMD5.0mmx7.0mm ±25ppm 0°Cto+70°C
EB13K7F2H-32.768K CMOS 3.3Vdc SMD5.0mmx7.0mm ±20ppm 0°Cto+70°C
EB13K7G2H-32.768K CMOS 3.3Vdc SMD5.0mmx7.0mm ±100ppm -40°Cto+85°C
EB13K7H2H-32.768K CMOS 3.3Vdc SMD5.0mmx7.0mm ±50ppm -40°Cto+85°C
EB13K7J2H-32.768K CMOS 3.3Vdc SMD5.0mmx7.0mm ±25ppm -40°Cto+85°C
EB15K2C2H-32.768K CMOS 2.5Vdc SMD2.0mmx2.5mm ±100ppm 0°Cto+70°C
EB15K2D2H-32.768K CMOS 2.5Vdc SMD2.0mmx2.5mm ±50ppm 0°Cto+70°C
EB15K2E2H-32.768K CMOS 2.5Vdc SMD2.0mmx2.5mm ±25ppm 0°Cto+70°C
        在過去的兩年中，供應(yīng)鏈的挑戰(zhàn)使得具有較低電鍍負(fù)載的行業(yè)標(biāo)準(zhǔn)3.2x1.5mm和2.0x1.2mm音叉石英晶體的大批量供應(yīng)變得非常復(fù)雜。Abracon晶振考慮到這一挑戰(zhàn)，開發(fā)了其微型ABS05系列的4.0pF鍍層版本。
EB15K2F2H-32.768K CMOS 2.5Vdc SMD2.0mmx2.5mm ±20ppm 0°Cto+70°C
EB15K2G2H-32.768K CMOS 2.5Vdc SMD2.0mmx2.5mm ±100ppm -40°Cto+85°C
EB15K2H2H-32.768K CMOS 2.5Vdc SMD2.0mmx2.5mm ±50ppm -40°Cto+85°C
EB15K2J2H-32.768K CMOS 2.5Vdc SMD2.0mmx2.5mm ±25ppm -40°Cto+85°C
EB15K4C2H-32.768K CMOS 2.5Vdc SMD2.5mmx3.2mm ±100ppm 0°Cto+70°C
EB15K4D2H-32.768K CMOS 2.5Vdc SMD2.5mmx3.2mm ±50ppm 0°Cto+70°C
EB15K4E2H-32.768K CMOS 2.5Vdc SMD2.5mmx3.2mm ±25ppm 0°Cto+70°C
EB15K4G2H-32.768K CMOS 2.5Vdc SMD2.5mmx3.2mm ±100ppm -40°Cto+85°C
EB15K4H2H-32.768K CMOS 2.5Vdc SMD2.5mmx3.2mm ±50ppm -40°Cto+85°C
EB15K4J2H-32.768K CMOS 2.5Vdc SMD2.5mmx3.2mm ±25ppm -40°Cto+85°C
EB15K5C2H-32.768K CMOS 2.5Vdc SMD3.2mmx5.0mm ±100ppm 0°Cto+70°C
EB15K5D2H-32.768K CMOS 2.5Vdc SMD3.2mmx5.0mm ±50ppm 0°Cto+70°C
EB15K5E2H-32.768K CMOS 2.5Vdc SMD3.2mmx5.0mm ±25ppm 0°Cto+70°C
EB15K5F2H-32.768K CMOS 2.5Vdc SMD3.2mmx5.0mm ±20ppm 0°Cto+70°C
EB15K5G2H-32.768K CMOS 2.5Vdc SMD3.2mmx5.0mm ±100ppm -40°Cto+85°C
EB15K5H2H-32.768K CMOS 2.5Vdc SMD3.2mmx5.0mm ±50ppm -40°Cto+85°C
EB15K5J2H-32.768K CMOS 2.5Vdc SMD3.2mmx5.0mm ±25ppm -40°Cto+85°C
EB15K7C2H-32.768K CMOS 2.5Vdc SMD5.0mmx7.0mm ±100ppm 0°Cto+70°C
EB15K7D2H-32.768K CMOS 2.5Vdc SMD5.0mmx7.0mm ±50ppm 0°Cto+70°C
EB15K7E2H-32.768K CMOS 2.5Vdc SMD5.0mmx7.0mm ±25ppm 0°Cto+70°C
EB15K7F2H-32.768K CMOS 2.5Vdc SMD5.0mmx7.0mm ±20ppm 0°Cto+70°C
EB15K7G2H-32.768K CMOS 2.5Vdc SMD5.0mmx7.0mm ±100ppm -40°Cto+85°C
EB15K7H2H-32.768K CMOS 2.5Vdc SMD5.0mmx7.0mm ±50ppm -40°Cto+85°C
EB15K7J2H-32.768K CMOS 2.5Vdc SMD5.0mmx7.0mm ±25ppm -40°Cto+85°C
EB16K2C2H-32.768K CMOS 1.8Vdc SMD2.0mmx2.5mm ±100ppm 0°Cto+70°C
EB16K2D2H-32.768K CMOS 1.8Vdc SMD2.0mmx2.5mm ±50ppm 0°Cto+70°C
EB16K2E2H-32.768K CMOS 1.8Vdc SMD2.0mmx2.5mm ±25ppm 0°Cto+70°C
EB16K2F2H-32.768K CMOS 1.8Vdc SMD2.0mmx2.5mm ±20ppm 0°Cto+70°C
EB16K2G2H-32.768K CMOS 1.8Vdc SMD2.0mmx2.5mm ±100ppm -40°Cto+85°C
EB16K2H2H-32.768K CMOS 1.8Vdc SMD2.0mmx2.5mm ±50ppm -40°Cto+85°C
         Abracon的ABS07系列3.2x15x0.9毫米音叉石英晶體已成為從工業(yè)和醫(yī)療電子產(chǎn)品到消費(fèi)物聯(lián)網(wǎng)小工具的廣泛應(yīng)用中使用的工作室解決方案。隨著下一代MCU的使用已經(jīng)站穩(wěn)腳跟，對ABS07的較低電鍍負(fù)載（低至4.0pF）版本的需求獲得了動(dòng)力。
        同時(shí)，業(yè)界不斷追求終端產(chǎn)品設(shè)計(jì)小型化的趨勢已經(jīng)讓位于以Abracon的ABS06系列產(chǎn)品為代表的2.0x1.2x0.6毫米音叉石英晶體的需求。特別是Abracon的4.0pF電鍍負(fù)載的ABS06-107引起了廣泛關(guān)注。它提供了較低電鍍負(fù)載與優(yōu)化等效串聯(lián)電阻(ESR)性能的獨(dú)特組合，使其非常適合節(jié)能大猩猩芯片。
EB16K2J2H-32.768K CMOS 1.8Vdc SMD2.0mmx2.5mm ±25ppm -40°Cto+85°C
EB16K4C2H-32.768K CMOS 1.8Vdc SMD2.5mmx3.2mm ±100ppm 0°Cto+70°C
EB16K4D2H-32.768K CMOS 1.8Vdc SMD2.5mmx3.2mm ±50ppm 0°Cto+70°C
EB16K4E2H-32.768K CMOS 1.8Vdc SMD2.5mmx3.2mm ±25ppm 0°Cto+70°C
EB16K4G2H-32.768K CMOS 1.8Vdc SMD2.5mmx3.2mm ±100ppm -40°Cto+85°C
EB16K4H2H-32.768K CMOS 1.8Vdc SMD2.5mmx3.2mm ±50ppm -40°Cto+85°C
EB16K4J2H-32.768K CMOS 1.8Vdc SMD2.5mmx3.2mm ±25ppm -40°Cto+85°C
EMRB61B-32.768K CMOS 1.8Vdc SMD1.2mmx2.0mm ±75ppm -10°Cto+70°C
EMRB61C-32.768K CMOS 1.8Vdc SMD1.2mmx2.0mm ±100ppm -40°Cto+85°C
EMRB62B-32.768K CMOS 2.5Vdc SMD1.2mmx2.0mm ±75ppm -10°Cto+70°C
EMRB62C-32.768K CMOS 2.5Vdc SMD1.2mmx2.0mm ±100ppm -40°Cto+85°C
EMRB63B-32.768K CMOS 3.3Vdc SMD1.2mmx2.0mm ±75ppm -10°Cto+70°C
EMRB63C-32.768K CMOS 3.3Vdc SMD1.2mmx2.0mm ±100ppm -40°Cto+85°C
EMRB64B-32.768K CMOS 2.8Vdc SMD1.2mmx2.0mm ±75ppm -10°Cto+70°C
EMRB64C-32.768K CMOS 2.8Vdc SMD1.2mmx2.0mm ±100ppm -40°Cto+85°C
EMRB65B-32.768K CMOS 3.0Vdc SMD1.2mmx2.0mm ±75ppm -10°Cto+70°C
EMRB65C-32.768K CMOS 3.0Vdc SMD1.2mmx2.0mm ±100ppm -40°Cto+85°C
EMRB81B-32.768K CMOS 1.8Vdc CSP0.8mmx1.5mm ±75ppm -10°Cto+70°C
EMRB81C-32.768K CMOS 1.8Vdc CSP0.8mmx1.5mm ±100ppm -40°Cto+85°C
EMRB82B-32.768K CMOS 2.5Vdc CSP0.8mmx1.5mm ±75ppm -10°Cto+70°C
EMRB82C-32.768K CMOS 2.5Vdc CSP0.8mmx1.5mm ±100ppm -40°Cto+85°C
EMRB83B-32.768K CMOS 3.3Vdc CSP0.8mmx1.5mm ±75ppm -10°Cto+70°C
EMRB83C-32.768K CMOS 3.3Vdc CSP0.8mmx1.5mm ±100ppm -40°Cto+85°C
EMRB84B-32.768K CMOS 2.8Vdc CSP0.8mmx1.5mm ±75ppm -10°Cto+70°C
EMRB84C-32.768K CMOS 2.8Vdc CSP0.8mmx1.5mm ±100ppm -40°Cto+85°C
EMRB85B-32.768K CMOS 3.0Vdc CSP0.8mmx1.5mm ±75ppm -10°Cto+70°C
EMRB85C-32.768K CMOS 3.0Vdc CSP0.8mmx1.5mm ±100ppm -40°Cto+85°C
        ECLIPTEK Crystal是頻率控制市場公認(rèn)的市場領(lǐng)導(dǎo)者。Ecliptek品牌專注于快速轉(zhuǎn)向可編程晶體和MEMS振蕩器設(shè)備，可縮短上市時(shí)間并消除較長的交貨時(shí)間。Ecliptek由Abracon提供支持，Abracon提供最新的技術(shù)設(shè)計(jì)支持和全球供應(yīng)鏈靈活性，以解決客戶當(dāng)今面臨的獨(dú)特挑戰(zhàn)。
        然而，1.6x1.0x0.5mm的ABS05系列可以輕松替換當(dāng)前設(shè)計(jì)中較大尺寸的ABS06和ABS07系列，而不會(huì)犧牲性能要求或增加額外的設(shè)計(jì)壓力。它還可以在較新的設(shè)計(jì)中進(jìn)一步減少消耗的表面積。
EMTB81A3D-32.768K CMOS 1.8Vdc CSP0.8mmx1.5mm ±5.0ppm 0°Cto+70°C
EMTB81A8D-32.768K CMOS 1.8Vdc CSP0.8mmx1.5mm ±5.0ppm -40°Cto+85°C
EMTB82A3D-32.768K CMOS 2.5Vdc CSP0.8mmx1.5mm ±5.0ppm 0°Cto+70°C
EMTB82A8D-32.768K CMOS 2.5Vdc CSP0.8mmx1.5mm ±5.0ppm -40°Cto+85°C
EMTB83A3D-32.768K CMOS 3.3Vdc CSP0.8mmx1.5mm ±5.0ppm 0°Cto+70°C
EMTB83A8D-32.768K CMOS 3.3Vdc CSP0.8mmx1.5mm ±5.0ppm -40°Cto+85°C
EMTB84A3D-32.768K CMOS 2.8Vdc CSP0.8mmx1.5mm ±5.0ppm 0°Cto+70°C
EMTB84A8D-32.768K CMOS 2.8Vdc CSP0.8mmx1.5mm ±5.0ppm -40°Cto+85°C
EMTB85A3D-32.768K CMOS 3.0Vdc CSP0.8mmx1.5mm ±5.0ppm 0°Cto+70°C
EMTB85A8D-32.768K CMOS 3.0Vdc CSP0.8mmx1.5mm ±5.0ppm -40°Cto+85°C
EQTB31D1DH-32.768K CMOS 1.8Vdc SMD2.5mmx3.2mm ±5.0ppm 0°Cto+50°C
EQTB31D2DH-32.768K CMOS 1.8Vdc SMD2.5mmx3.2mm ±5.0ppm -10°Cto+60°C
EQTB31D3DH-32.768K CMOS 1.8Vdc SMD2.5mmx3.2mm ±5.0ppm 0°Cto+70°C
EQTB31D4DH-32.768K CMOS 1.8Vdc SMD2.5mmx3.2mm ±5.0ppm -20°Cto+70°C
EQTB31D5DH-32.768K CMOS 1.8Vdc SMD2.5mmx3.2mm ±5.0ppm -30°Cto+60°C
EQTB31D6DH-32.768K CMOS 1.8Vdc SMD2.5mmx3.2mm ±5.0ppm -30°Cto+75°C
EQTB31D7DH-32.768K CMOS 1.8Vdc SMD2.5mmx3.2mm ±5.0ppm -30°Cto+85°C
EQTB31D8DH-32.768K CMOS 1.8Vdc SMD2.5mmx3.2mm ±5.0ppm -40°Cto+85°C
EQTB32D1DH-32.768K CMOS 2.5Vdc SMD2.5mmx3.2mm ±5.0ppm 0°Cto+50°C
EQTB32D2DH-32.768K CMOS 2.5Vdc SMD2.5mmx3.2mm ±5.0ppm -10°Cto+60°C
        采用最先進(jìn)的調(diào)諧技術(shù)，ABS05器件現(xiàn)在可提供±20ppm和±25ppm的設(shè)置容差，有效的振蕩器環(huán)路負(fù)載電容為4.0pF。此外，ESR經(jīng)過優(yōu)化以保持最大90kΩ的閾值，在與最新的節(jié)能MCU和其他大猩猩芯片組配合時(shí)實(shí)現(xiàn)穩(wěn)健運(yùn)行。
        此外，由于最近的供應(yīng)鏈問題，設(shè)計(jì)人員可能希望在他們的設(shè)計(jì)中考慮全面、包羅萬象的焊盤圖案。這種方法通過在同一布局中使用ABS07、ABS06或ABS05封裝來滿足設(shè)計(jì)要求，從而提供了設(shè)計(jì)靈活性。
EQTB32D3DH-32.768K CMOS 2.5Vdc SMD2.5mmx3.2mm ±5.0ppm 0°Cto+70°C
EQTB32D4DH-32.768K CMOS 2.5Vdc SMD2.5mmx3.2mm ±5.0ppm -20°Cto+70°C
EQTB32D5DH-32.768K CMOS 2.5Vdc SMD2.5mmx3.2mm ±5.0ppm -30°Cto+60°C
EQTB32D6DH-32.768K CMOS 2.5Vdc SMD2.5mmx3.2mm ±5.0ppm -30°Cto+75°C
EQTB32D7DH-32.768K CMOS 2.5Vdc SMD2.5mmx3.2mm ±5.0ppm -30°Cto+85°C
EQTB32D8DH-32.768K CMOS 2.5Vdc SMD2.5mmx3.2mm ±5.0ppm -40°Cto+85°C
EQTB33D1DH-32.768K CMOS 3.3Vdc SMD2.5mmx3.2mm ±5.0ppm 0°Cto+50°C
EQTB33D2DH-32.768K CMOS 3.3Vdc SMD2.5mmx3.2mm ±5.0ppm -10°Cto+60°C
EQTB33D3DH-32.768K CMOS 3.3Vdc SMD2.5mmx3.2mm ±5.0ppm 0°Cto+70°C
EQTB33D4DH-32.768K CMOS 3.3Vdc SMD2.5mmx3.2mm ±5.0ppm -20°Cto+70°C
EQTB33D5DH-32.768K CMOS 3.3Vdc SMD2.5mmx3.2mm ±5.0ppm -30°Cto+60°C
EQTB33D6DH-32.768K CMOS 3.3Vdc SMD2.5mmx3.2mm ±5.0ppm -30°Cto+75°C
EQTB33D7DH-32.768K CMOS 3.3Vdc SMD2.5mmx3.2mm ±5.0ppm -30°Cto+85°C
EQTB33D8DH-32.768K CMOS 3.3Vdc SMD2.5mmx3.2mm ±5.0ppm -40°Cto+85°C
EQTB35D1DH-32.768K CMOS 3.0Vdc SMD2.5mmx3.2mm ±5.0ppm 0°Cto+50°C
EQTB35D2DH-32.768K CMOS 3.0Vdc SMD2.5mmx3.2mm ±5.0ppm -10°Cto+60°C
EQTB35D3DH-32.768K CMOS 3.0Vdc SMD2.5mmx3.2mm ±5.0ppm 0°Cto+70°C
EQTB35D4DH-32.768K CMOS 3.0Vdc SMD2.5mmx3.2mm ±5.0ppm -20°Cto+70°C
EQTB35D5DH-32.768K CMOS 3.0Vdc SMD2.5mmx3.2mm ±5.0ppm -30°Cto+60°C
EQTB35D6DH-32.768K CMOS 3.0Vdc SMD2.5mmx3.2mm ±5.0ppm -30°Cto+75°C
        Abracon,LLC成立于1992年，是無源元件的行業(yè)領(lǐng)導(dǎo)者，通過全球分銷網(wǎng)絡(luò)提供頻率控制和定時(shí)設(shè)備、射頻和天線以及電感器和連接解決方??案。Abracon總部位于德克薩斯州斯派斯伍德，在全球擁有銷售、工程和運(yùn)營團(tuán)隊(duì)。Abracon晶振以服務(wù)、質(zhì)量和技術(shù)專長為公司核心，為AELCrystals、Ecliptek、Fox、ILSI和ProAnt品牌提供支持，同時(shí)在通信、運(yùn)輸、工業(yè)、醫(yī)療、消費(fèi)、航空航天等市場實(shí)現(xiàn)創(chuàng)新的互聯(lián)物聯(lián)網(wǎng)解決方案和防御，以及超越。訪問www.lbfp.com.cn了解更多信息。
EQTB35D7DH-32.768K CMOS 3.0Vdc SMD 2.5mm x 3.2mm ±5.0ppm -30°C to +85°C
EQTB35D8DH-32.768K CMOS 3.0Vdc SMD 2.5mm x 3.2mm ±5.0ppm -40°C to +85°C
EQTB3AD1DH-32.768K CMOS 5.0Vdc SMD 2.5mm x 3.2mm ±5.0ppm 0°C to +50°C
EQTB3AD2DH-32.768K CMOS 5.0Vdc SMD 2.5mm x 3.2mm ±5.0ppm -10°C to +60°C
EQTB3AD3DH-32.768K CMOS 5.0Vdc SMD 2.5mm x 3.2mm ±5.0ppm 0°C to +70°C
EQTB3AD4DH-32.768K CMOS 5.0Vdc SMD 2.5mm x 3.2mm ±5.0ppm -20°C to +70°C
EQTB3AD5DH-32.768K CMOS 5.0Vdc SMD 2.5mm x 3.2mm ±5.0ppm -30°C to +60°C
EQTB3AD6DH-32.768K CMOS 5.0Vdc SMD 2.5mm x 3.2mm ±5.0ppm -30°C to +75°C
EQTB3AD7DH-32.768K CMOS 5.0Vdc SMD 2.5mm x 3.2mm ±5.0ppm -30°C to +85°C
EQTB3AD8DH-32.768K CMOS 5.0Vdc SMD 2.5mm x 3.2mm ±5.0ppm -40°C to +85°C

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